Three dimensional (3D) Integrated Circuits has emerged as an attractive option for overcoming the barriers in interconnect scaling. The key benefits of 3D ICs over a traditional two dimensional chip includes the reduction on global interconnects, higher packing density and smaller footprint, and the support for realization of mixed-technology integration. To efficiently exploit the benefits of 3D technologies, design techniques and methodologies for supporting 3D designs are imperative; design space exploration at the architectural level is also essential to fully take advantage of the 3D integration technologies and build a high performance microprocessor.

We are pleased to announce a call for papers for a special issue of ACM Journal on Emerging Technologies in Computing Systems on Three-dimensional Integrated Circuits and Microarchitectures. The submission may be based on works that were previously published in refereed conferences, however, the submission should contain at least 30% new material, and the authors should state clearly how the submission differs from and/or expands on the workshop or conference paper.

Please submit your paper to http://mc.manuscriptcentral.com/acm in the JETC section. Please specify "SPECIAL ISSUE ON 3D ICs and Microarchitectures" on your cover page and in the notes section of the Web site submission form.

Important Dates:

Submission Deadline: 11/15/07 Extended Deadline: 12/15/07
Acceptance Notice: 3/30/08
Final Manuscript Due: 5/31/08

Guest Editors

Yuan Xie
Pennsylvania State University
yuanxie@cse.psu.edu

Jason Cong
University of California at Los Angeles
cong@cs.ucla.edu

Paul D. Franzon
North Carolina State University
paulf@ncsu.edu