Xiangyu Dong is now a first-year Ph.D. student advised by
Prof Yuan Xie.
Xiangyu's research interests include Computer Architecture and VLSI Design, and he also has a background of Image Processing.
Xiangyu's research projects are mainly focused on 3D IC design.
Xiangyu's research interests include Computer Architecture and VLSI Design, and he also has a background of Image Processing.
Xiangyu's research projects are mainly focused on 3D IC design.
What is 3D IC?
A three dimensional (3D) chip is a stack of multiple device layers with direct vertical interconnects tunneling through them. A key benefit of this approach over a traditional two dimensional chip is the ability to reduce the length of long interconnects. Prior efforts have focused on developing different fabrication techniques involved in stacking multiple device layers and in forming the vertical interconnects. The size and density of the vertical interconnects that can tunnel between the different device layers varies based on the underlying technology used to fabricate the 3D chips. To efficiently exploit the benefits of 3D technologies, design techniques and methodologies for supporting 3D designs are imperative.
Recently, Xiangyu is also trying to get involved into the research of emerging non-volatile memories, such as PRAM and MRAM.A three dimensional (3D) chip is a stack of multiple device layers with direct vertical interconnects tunneling through them. A key benefit of this approach over a traditional two dimensional chip is the ability to reduce the length of long interconnects. Prior efforts have focused on developing different fabrication techniques involved in stacking multiple device layers and in forming the vertical interconnects. The size and density of the vertical interconnects that can tunnel between the different device layers varies based on the underlying technology used to fabricate the 3D chips. To efficiently exploit the benefits of 3D technologies, design techniques and methodologies for supporting 3D designs are imperative.
- Yuan Xie
What is MRAM?
Magnetoresistive Random Access Memory (MRAM) is a non-volatility computer memory (NVRAM) technology, which has been under development since the 1990s. Continued increases in density of existing memory technologies, notably Flash RAM and DRAM kept MRAM in a niche hole in the market, but its proponents believe that the advantages are so overwhelming that MRAM will eventually become dominant.
Magnetoresistive Random Access Memory (MRAM) is a non-volatility computer memory (NVRAM) technology, which has been under development since the 1990s. Continued increases in density of existing memory technologies, notably Flash RAM and DRAM kept MRAM in a niche hole in the market, but its proponents believe that the advantages are so overwhelming that MRAM will eventually become dominant.
- www.wikipedia.org
What is PRAM?
PRAM (also known as Phase-change memory) is a type of non-volatile computer memory. PRAM uses the unique behavior of chalcogenide glass, which can be "switched" between two states, crystalline and amorphous, with the application of heat. Recent versions can achieve two additional distinct states, effectively doubling its storage capacity. PRAM is one of a number of new memory technologies that are attempting to compete in the non-volatile role with the almost universal Flash memory, which has a number of practical problems these replacements hope to address.- www.wikipedia.org