Xiangyu Dong
Ph.D. Candidate
MDL Group, Computer Science & Engineering
354B IST Building,
The Pennsylvania State University,
State College, PA, 16802
Tel: (814)777-1376
Email: xydong AT cse DOT psu DOT edu
Ph.D. Candidate
MDL Group, Computer Science & Engineering
354B IST Building,
The Pennsylvania State University,
State College, PA, 16802
Tel: (814)777-1376
Email: xydong AT cse DOT psu DOT edu
News:
Sept 26, 2008: My paper, "System-Level Cost Analysis and Design Exploration for Three-Dimensional Integrated Circuits (3D ICs)", is accepted by the 14th Asia and South Pacific Design Automation Conference, which will be held on next January in Yokohama, Japan.
Aug 31, 2008: I arrive in Palo Alto, California. And, I'll be a research co-op at HP Labs during the following 3 months.
May 11, 2008: I start my 4-week vacation in East and South-east Asia. I'll be in Tokyo for 1 week, in Kualua Lumpur and Singapore for 1 week, and in Shanghai for 2 weeks.
Feb 27, 2008: I pass the Ph.D. Candidacy Exams on the tracks of Computer Network, Data Structures & Algorithms, and Computer Architecture.
Feb 22, 2008: My first paper, "Circuit and Microarchitecture Evaluation of 3D Stacking Magnetic RAM (MRAM) as a Universal Memory Replacement", is accepted by Design Automation Conference (DAC) 2008.
Sept 26, 2008: My paper, "System-Level Cost Analysis and Design Exploration for Three-Dimensional Integrated Circuits (3D ICs)", is accepted by the 14th Asia and South Pacific Design Automation Conference, which will be held on next January in Yokohama, Japan.
Aug 31, 2008: I arrive in Palo Alto, California. And, I'll be a research co-op at HP Labs during the following 3 months.
May 11, 2008: I start my 4-week vacation in East and South-east Asia. I'll be in Tokyo for 1 week, in Kualua Lumpur and Singapore for 1 week, and in Shanghai for 2 weeks.
Feb 27, 2008: I pass the Ph.D. Candidacy Exams on the tracks of Computer Network, Data Structures & Algorithms, and Computer Architecture.
Feb 22, 2008: My first paper, "Circuit and Microarchitecture Evaluation of 3D Stacking Magnetic RAM (MRAM) as a Universal Memory Replacement", is accepted by Design Automation Conference (DAC) 2008.