Education
| 2009 - present |
Ph.D., Department of Computer Science and
Engineering, Pennsylvania State University |
| 2007 - 2008 |
M.S., Department of Electrical and Computer Engineering, North Carolina State University |
| 2001 - 2005 |
B.S., Department of Microelectronics, Peking University |
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Publications
Conference
- Jing Xie, Yuan Xie,
Yield-Aware Time-Efficient Testing and Self-fixing Design For TSV-Based 3D ICs. In Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), 2012.
- Jing Xie, Tao Zhang, Matt Poremba, Yuan Xie,
A 3D SoC Design With On-Chip DRAM Stacking. In University Booth of Design Automation Conference (DAC), 2011.
- Jin Ouyang, Jing Xie, Matthew Poremba, Yuan Xie,
Evaluation of TSV-free 3D Network-on-Chip. In Proceedings of SRC Technical Conference (TECHCON), 2011.
- Jing Xie, Jin Ouyang, Yuan Xie,
Mitigating Electromigration in Power Supply
Network. In Workshop on Diversity in Design Automation
and Test (WD^2AT), 2011.
- Jing Xie, Xiangyu Dong, Yuan Xie,
3D Memory Stacking for Fast Checkpointing/Restore
Applications. In Proceedings of IEEE International 3D Systems Integration Conference (3DIC), 2010.
- Tao Zhang, Jing Xie, Yuan Xie,
3D SoC Design for H.264 Application With On-Chip DRAM Stacking. In Proceedings of IEEE International 3D Systems Integration Conference (3DIC), 2010.
- Jing Xie, Jishen Zhao, Yuan Xie,
Architectural Benefits and Design Challenges for
Three-dimensional Integrated Circuits. In Proceedings
of IEEE biennial Asia Pacific Conference on Circuits and
Systems (APCCAS), 2010.
- Jin Ouyang, Jing Xie, Matthew Poremba, Yuan Xie,
Evaluation of Using Inductive/Capacitive-Coupling Vertical Inter-connects in 3D Network-on-Chip. In Proceedings of the International Conference on Computer-Aided Design (ICCAD), 2010.
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